System-in-Package (SiP) Manufacturing

As SiP packages contain two or more chips stacked vertically as well as horizontally, micro-vias with typical diameters ranging from approximately 200 to just a few microns are used to provide vertical electrical connections among them. These micro-vias may be present either in an interposer (which is also referred to as an IC substrate) layer or within the chips themselves. Formation of micro-vias is commonly accomplished through chemical etching, but this process has limitations. Although chemical etching is a proven methodology for silicon and glass, etching cannot be used with ceramics or organic materials. Additionally, the waste management required for chemical etching processes presents extra complications and costs.

Cutting various materials as part of the SiP manufacturing process is also a very delicate process. Whether cutting an interposer, depaneling a package substrate or scribing and dicing a silicon die, the size of the cuts can be extremely small and must be made with the highest precision and minimal surrounding damage. As chip designs become even more advanced and miniaturized with higher densities, the type of cuts required will also become more complex.

Furthermore, as the materials become thinner, contact-based mechanical methods could cause damage such as cracks and tears, so therefore, a non-contact laser process will improve yields and throughput.

The assorted types of materials which SiP packages comprise—for example, ceramics, organic laminate and glass—respond differently to different manufacturing processes. To further complicate matters, some materials are inhomogeneous, such as ABF and FR4, which contains glass fibers and epoxy resin, and some laminates, which are embedded with copper traces. Traditional manufacturing processes including mechanical saws and etching may work well with some materials but not as well with others. The same is also true with laser manufacturing processes, as not all lasers are the same. Furthermore, tradeoffs in areas including speed, precision, surrounding damage and cost are always present when comparing manufacturing processes.

MKS has a deep understanding of the challenges faced in designing and building SiP manufacturing systems. We’ve turned this knowledge into unique product features that provide an advantage when used in SiP manufacturing.

• 50+ years and thousands of alignment systems for optical applications
• Long-term partner to semiconductor manufacturing companies
• Full range of products: lasers, optics, motion, opto-mechanics, beam analysis
  • Custom capabilities
  • Product availability
• Ability to scale with you
• Global corporation and presence

Lasers	Beam Analysis	Motion Control	Opto-Mechanics
Nanosecond and picosecond lasers DPSS Q-switched lasers High power hybrid fiber lasers	High power laser thermal sensors High power beam profilers Laser power/energy meters	Full range of motorized stages Motion controllers Manual Positioners Custom assemblies	Mirror mounts Lens positioners Integrated optical, opto-mechanical and electronic subassemblies

One of the challenges for laser materials processing—including cutting and drilling—is removing only the desired material, usually through localized heating, while at the same time minimizing the extent of the heat-affected zone (HAZ) to any of the remaining material. Delivering laser irradiation with near perfect beam quality precisely to the target region is a necessary step to achieving this desired result. Shorter wavelengths and, in particular, shorter pulse widths are advantageous to achieving higher-quality results.

For singulation of SiP devices, lasers in the ns pulse width regime at UV and green wavelengths, such as the Spectra Physics^® Talon laser, may be suitable. However, challenges arise if excess heating cannot be tolerated, especially as these devices become further condensed and more densely packed. This leads to an interest in laser processing with even shorter pulse durations for reduced HAZ. Such may be the case if there are encapsulations that use a heat-sensitive bonding media, such as solder or adhesive, which may fail under excess thermal loading. Moreover, the presence of copper traces embedded within the SiP laminate, which can become excessively hot and result in the potential for layer delamination, can create additional difficulties.

To meet these challenges and to enable the advancement of SiP technology, ultrashort pulse (USP) lasers, like the Spectra Physics IceFyre^® laser, can be employed. Ultrashort pulse widths in the ps and fs regime yield intense peak powers that result in nonlinear absorption at the sample for instantaneous material vaporization, very minimal heat transfer into the material, and a negligible HAZ. The result is a fast, high precision, high-quality cut or drill which leads to higher throughput and fewer part failures.

• IceFyre^® Picosecond Lasers: Spectra-Physics IceFyre picosecond lasers set a new standard for picosecond micromachining and can provide the ultimate solutions for SiP manufacturing. The UV version enables premium quality drilling of micro-vias through ceramic, organic and glass interposers. Both the UV and green versions are great for cutting ceramic interposers, depaneling and scribing and dicing silicon dies. Additionally, the IR version can be used to cut glass interposers. Based on Spectra-Physics’ It’s in the Box™ design, the laser and controller are integrated into a single, compact package, and IceFyre is manufactured to provide 24/7 industrial reliability.

	IceFyre®
Wavelengths	UV	Green	IR
Power	Up to >50 W
Pulse Width	<12 ps	<15 ps
Repetition Rates	Single Shot to 10 MHz
Max Pulse Energy	Up to >40 µJ	Up to >60 µJ	Up to >200 µJ
Other Features	24/7 industrial reliability TimeShift™ technology for pulse control Laser/controller in single, compact package

• Talon^® Ace™ Lasers: Delivering an industry-leading >100 Watts of UV power, Talon Ace offers the lowest cost-per-Watt and cost of ownership for high power nanosecond UV lasers. This laser can be employed for a whole host of applications including drilling micro-vias through ceramic, organic laminate and glass interposers, cutting ceramic and organic laminate interposers, depaneling, and scribing and dicing dies. Talon Ace also includes our proprietary TimeShift programmable burst-mode technology for the most versatile pulse control, leading to increased process speed and quality. Designed to provide 24/7 industrial reliability, the laser and controller are integrated into a single, compact package.
• Talon^® Nanosecond Lasers: For the best combination of performance, reliability and cost in SiP laser manufacturing, Spectra-Physics Talon lasers deliver excellent results. Talon works exceptionally well for cutting ceramic and organic laminate interposers, depaneling and scribing and dicing silicon dies. The UV version in particular is also able to drill micro-vias through ceramic and organic interposers. The Talon provides high quality results, but its cuts and drills may not be as pristine as the IceFyre’s. Talon’s advantage over IceFyre, though, is that it can cut and drill faster. Based on Spectra-Physics’ It’s in the Box™ design, the laser and controller are integrated into a single, compact package, and Talon is manufactured to provide 24/7 industrial reliability.
• Quasar^® High-Power Nanosecond Lasers: Other lasers highly suited for SiP manufacturing are the Spectra-Physics Quasar^® and Talon^® Ace nanosecond series of lasers. The Talon Ace UV100 is the highest-powered single mode UV laser in the industry, so it delivers fast micromachining and provides 24/7 industrial reliability. Like the IceFyre and Talon, the UV and green versions of the Quasar and Talon Ace can also be used for depaneling, scribing and dicing dies. And like the UV version of the IceFyre, the Quasar UV and Talon Ace UV can also drill micro-vias through ceramic, organic and glass interposers.

	Talon Ace	Talon	Quasar
Wavelengths	UV	UV or Green	UV or Green
Power	>100 W	UV: Up to >45 W Green: Up to >40 W	UV: Up to >80 W Green: Up to >95 W
Pulse Width	<2 to >50 ns	UV: <25 or 40 ns Green: <25 ns	<2 to >100 ns
Repetition Rates	Single shot to 5 MHz	0 to 500 kHz	0 to 3.5 MHz
Max Pulse Energy	Up to >500 µJ	UV: Up to >500 µJ Green: Up to 1000 µJ	UV: Up to >400 µJ Green: Up to >475 µJ
Other Features	24/7 industrial reliability TimeShift technology for pulse control Laser/controller in single, compact package	Laser/controller in single, compact package 24/7 industrial reliability E-Pulse™ technology for superb stability	24/7 industrial reliability TimeShift™ technology for pulse control

Presented here is a summary of recommended MKS lasers for various SiP manufacturing applications. Please use this as a reference guide only, and always contact us to discuss your application and requirements in detail so that we may provide the best solution for you.

* Dicing thin wafers < 100 µm

Even with the advantages that lasers have over traditional tools, laser systems can still degrade over time. Some causes of degradation include thermal effects on a laser system’s internal components, vibrations or shock and debris near the processing site. These issues could affect laser performance in a number of ways. First, output power may be reduced, causing the laser to be less efficient. Another problem that may be caused is a change in the focus or other profile of the beam, which may lead to a cut or drill to be off target, too deep, low quality or possibly damaging to another part of the material.

Therefore, to ensure the highest quality of manufacturing SiP chips and to minimize the possibility of production down-time, it is crucial to monitor the laser beam frequently with appropriate instruments–like Ophir® power sensors, power meters and beam profilers–that can operate at the laser’s wavelength while handling its maximum output power level.

• Thermal Effects
• Debris from Process
• Vibrations and Shock

There are three types of beam analysis instruments to monitor your laser: (1) sensors and detectors to measure power, (2) power meters to process the information provided by sensors and (3) beam profilers to determine focus position and other beam characteristics. Shown below are the main criteria for choosing such instruments.

• Compatible with laser wavelength
• Power/energy range/density
• Beam size
• Calibrated power measurement

• Compatible with sensor
• Connect to system/PC
• Track process data over time
• Compare multiple measurements at once

• Measurement of multiple attributes
  • Focal shift
  • Focal spot size
  • Laser power and power density
  • Changes over time
  • Laser propagation characteristics
• Speed of measurement

Laser Power Sensors

MKS offers a comprehensive portfolio of Ophir^® laser thermal power sensors, several of which can measure the optical output power of short- and ultrashort-pulsed lasers such as IceFyre, Talon, Talon Ace and Quasar. These sensors have a very high damage threshold to withstand the high optical peak power delivered by each pulse. Ophir sensors and meters meet the ISO/IEC 17025 standard for calibrated devices.

• Laser Thermal Power Thermal Sensors: very high damage thresholds for hundreds of watts power measurement.

	F150(200)A-CM-16	30(150)A-SV-17	F80(120)A-CM-17
Spectral Range	0.248-9.4 µm	0.19-11 µm	0.248-9.4 µm
Power Range	300 mW - 200 W	100 mW - 150 W	100 mW - 120 W
Energy Range	50 mJ – 200 J	50 mJ – 300 J	50 mJ – 200 J
Max Avg Power Density	35 kW/cm2	60 kW/cm2	35 kW/cm2
Max Energy Density (2 msec)	45 J/cm2	50 J/cm2	45 J/cm2
Aperture	Ø16 mm	Ø17 mm	Ø17.5 mm
Response Time	3 sec	1.7 sec	2 sec
Other Features	Not water-cooled

The recommended products above are the most popular models for semiconductor manufacturing. We have a lot more than these and you can use our online tools to find the ones that best fit your requirements.

• Sensor Finder and Laser Fluence Calculator

Power Meters		Virtual Power Meters
Centauri	StarBright Handheld	Juno+	EA-1
Extensive graphic displays on 7-in full color touchscreen display Advanced measurement processing Single- or dual-channel versions USB and RS-232 interfaces, with user-friendly software application Analog and TTL output External trigger input	Portable use For transmission checks "in the field" Variety of measurement modes and displays USB & RS-232 interfaces	USB connection to use PC as monitor User-friendly software Extensive graphic displays of data Advanced measurement processing Data logging	Ethernet adapter enables remote control and monitoring of sensor Telnet, HTTP and UDP protocols supported Interact with sensor through custom software or MKS user-friendly software Data logging

An effective way to analyze beam profile is with a camerabased system. Ophir beam profiling cameras allow real-time viewing and measuring of a laser’s structure in high resolution. Camera-based systems can also measure cross-sectional intensity of the laser and provide a complete 2-dimensional view of the laser mode.

• SP932U Beam Profiling Camera: high resolution, real-time viewing and measuring of laser structure with highest accuracy in the industry
• Pyrocam™ IV Beam Profiling Camera: generates full 2D profiles of CO2 and NIR lasers in CW or pulsed modes of any frequency
• NanoScan™ 2s Pyro/9/5 Scanning-Slit Profiler: sub-micron precision for generating 2 orthogonal linear profiles of a CO2 or IR beam

	SP932U	Pyrocam™ IV	NanoScan™
Spectral Range	190-1100 nm	13-355 nm, 1.06-3000 µm	190 nm-100 µm
Power Range			5 mW to 100 W
Damage Threshold	50 W/cm2, 1 J/cm2, <100 ns pulse width	2 W over entire array, 20 mJ/cm2 (1 ns pulse)
Beam Sizes	34.5 µm to 5.3 mm	1600 µm to 25.4 mm	20 µm to 6 mm
Pixels	2048 x 1536 Effective Pixels, 3.45 µm Pixel Size	320 x 320 Effective Pixels, 75 µm Pixel Size
PC Interface	USB 2.0	GigE	USB 2.0
Other Features	BeamGage® software included UltraCal™ correction algorithm Measures cross-sectional intensity 72 dB true dynamic resolution 24 Hz frame rate in 12-bit mode	BeamGage® software included CW or pulsed beams Measures cross-sectional intensity	Graphical user interface software included CW or >25 kHz pulsed beams

• Stages that MKS ships meet or exceed the guaranteed specifications
• Metrology reports included with each stage (ASME B5.57 and ISO 230-2 standards)
• Typically, the product will perform ~2x better than the guarantee

The target for a laser materials process—for instance, a silicon wafer for scribing and dicing—will often have to be positioned for the laser to perform its operation. The positioning requirements for SiP manufacturing can be extremely challenging. Accuracy in two dimensions is typically on the order of microns, as is the repeatability to ensure consistent results. To meet throughput demands, the required speed can be up to 1 meter/sec.

These performance requirements must be achievable in a demanding production environment. Thus, only high performing motorized positioners designed for continuous usage in industrial environments, like the IDL series linear positioners, should be considered.

High sensitivity and outstanding trajectory accuracy in a compact, robust and cost-effective package.

High load capacity, long travel, fast movement capable of high-duty cycles in industrial applications

High load capacity, mid-travel, fast movement capable of high-duty cycles in light industrial applications

XPS-D	XPS-RLD
High performance, complex motion trajectories Up to 8 axes Extensive analog and digital I/O Can synchronize galvos and positioners Best for the most demanding applications	High performance, complex motion trajectories Up to 4 axes Analog and digital I/O Can synchronize galvos and positioners Good for demanding R&D and low volume production

Optics

• Wavelength
• Laser Damage Threshold
  • Substrate Material
  • Coating
• Reflectivity/Transmission
• Size and Shape

High-energy laser mirrors optimized for 355, 532 and 1064 nm offer very high reflectivity and damage thresholds, and standard broadband metallic mirrors offer a more economic option for good performance and value over very broad spectral ranges.

High-energy lenses optimized for 355, 532 and 1064 nm offer very high transmission and damage thresholds, and standard fused silica lenses offer good performance and value over very broad spectral ranges.

Highest laser damage resistance and lowest reflection loss

For SiP operations that utilize CO2 lasers, Ophir lowabsorption CO2 laser lenses are specially designed to be used with high-powered 10.6-micron CO2 lasers of up to several kilowatts. These lenses absorb up to 50% less CO2 laser energy than standard anti-reflection coatings, resulting in higher efficiency, superior performance and longer lifetime.

Optimized for 355, 532 and 1064 nm, these cubes offer high damage thresholds, efficient polarization, and high extinction ratio.

Very high damage threshold, low sensitivity to temperature and wavelength variation.

Whenever optics are part of a laser system, they will have to be precisely positioned and steadily held over long periods of time. MKS offers the most comprehensive line of opto-mechanical components in the industry. Hundreds of optical mounts and positioners at various levels of performance and cost are readily available.

• Resolution/Sensitivity
• Long Term Stability
• Lockable
• Size and Shape

Optical component mounts are needed to hold and adjust optics. Long term stability and low drift is crucial. Minimizing drift caused by vibrations or thermal drift over time will ensure laser alignment to the desired spot and also reduce any potential downtime due to misalignment and errors. Having a locking mechanism on these mounts can also prevent misalignment of the beam, especially during shipping and also if anything else happens during usage.

HVM industrial mounts are recommended for robust long term usage in compact space. The Suprema^® mirror mount is excellent for its stainless steel construction that gives better thermal performance than an aluminum mirror mount. Ultra-fine 254-TPI adjusters provide alignment sensitivity as low as 1.5 arc sec. For applications that are really concerned about the thermal changes that can be potentially caused by prolonged high powered laser usage, the ZeroDrift™ version will compensate for some thermal changes as well. For those mirror mounts that need to be set-and-forget for a long period of time, we recommend the MFM flexure mirror Mount. These are excellent for their small footprint so that machine size can be reduced.

• Suprema® Stainless Steel Mirror Mounts: the industry's best thermal performance for long-term stability.
• M-Series Aluminum Mirror Mounts: the new standard for affordable mounts.

	Suprema	M-Series
Optic Diameters	0.5, 1 and 2 in.	0.5, 1 and 2 in.
Resolution	50, 100, 127 and 254 TPI	100 TPI
Angular Range	±7°	±4°
Material	Stainless Steel	Aluminum
Drive Types	Knob Hex Key Exchangeable Actuators	Knob Hex Key
Lockable Versions	Yes	No
Other Versions	Clear-Edge Front- and Rear-Loading Right- and Left-Handed Low Wavefront Distortion ZeroDrift™	Clear-Edge Front- and Rear-Loading Right- and Left-Handed

• HVM Top-Adjust Mirror Mounts: for use in compact spaces so your hands do not have to cross the beam path for adjustment.
• MFM Flexure Mirror Mounts: designed for "set and forget" applications.

	HVM-Series	MFM-Series
Optic Diameters	0.5, 1 and 2 in.	0.5, 0.75 and 1 in.
Resolution	80 and 100 TPI	80 and 100 TPI
Angular Range	±2.5°, ±3° and ±3.5°	±2.5°
Material	Anodized Aluminum, Stainless Steel	Stainless Steel
Drive Types	Hex Key	Hex Key
Lockable Versions	Yes	No
Other Features	Front- and Rear-Loading Versions	Shock Resistant Front- and Rear-Loading Versions Adhesive wells for permanent mounting

• A-Line™ Fixed Position Lens Mounts: fast, easy and economic mounting, aligning and focusing of optics.
• Compact Lens Positioners: ideal solution for applications with limited table space.
• LP Precision Multi-Axis Lens Positioners: highest performing lens positioners.

	A-Line	Compact	LP-Series
Optic Diameters	0.5 to 3 in.	0.5, 1 and 2 in.	0.5, 1 and 2 in.
Resolution	-	100 TPI	100 TPI
Adjustments	Fixed	XY, XYZ, XYZθxθy	XY, XYZ, XYZθxθy
Material	Aluminum	Aluminum	Aluminum
Other Features	Self-aligning design Large clear aperture Compatible with A-Line alignment system	Adapters for other optics Lockable positions	Zero-freeplay XY mechanism True Gimbal adjustments Independent non-influencing locks Adapters for other optics

• Ultima® Gimbaled Cube/Prism Mount: precision alignment of beamsplitter cubes and prisms.
• RSP High Performance Optic Rotation Mounts: smooth, continuous 360° rotation of optics.

	UGP-1	RSP-Series
Optic Size	0.5 and 1 in. cube	1 and 2 in.
Resolution	100 TPI	4 arc min
Angular Range	±5°	360°
Material	Aluminum	Aluminum
Drive Types	Knob w/ Hex Hole	Coarse: knurled edge Fine: knob
Lockable	Yes	Yes
Other Features	True gimbal motion Adapters for other optics	Full ball bearing races Adapters for other optics

• PX Forkless Optical Pedestals: Long-term stability of a pedestal at 1/3 the space.

	PX Post	PX Pedestal
Diameter	1 in.	1 in. with 1.25 in. flange
Heights	1, 2, 3 and 4 in.
Material	Stainless Steel
Other Features	Accessories for varying heights and mounting configurations

For applications that require holding alignments in place, we offer a comprehensive range of vibration isolation and damping solutions to ensure a stable system.

	Breadboards	Workstations	Table Systems	Tables and Legs
Dimension	Few feet	Few feet	Several feet, custom sizes	Several feet, custom sizes
Thickness	Few inches	Few inches	Several inches, custom thickness	Several inches, custom thickness
Portability	Must be carried or placed on "cart"	Casters on legs are standard	Larger, heavier, optional casters	Larger, heavier, optional casters
Isolation	None	✓	✓	✓
Damping	✓	✓	✓	✓
Setup	Base model comes assembled	Base model comes assembled	Support frame included but not assembled May need help from riggers	Tables, legs sold separately May need help from riggers