High Load Hexapod, 85 kg Centered Load Capacity, M6

The HXP200S-MECA High Load 6-Axis Hexapod is a parallel kinematic motion device that provides six degrees of freedom: X, Y, Z, pitch, roll, and yaw. The HXP200S is a wider and stiffer version of the HXP200, capable of handling 85 kg, centered and offset loads of at least 11 kg. The HXP200S also features long travel ranges (up to ±59 mm), fast speeds (up to 81 mm/s), high stiffness and stability. The HXP200S is driven by six DC servo motor actuators which provide precise MIM (0.15µm).. A brake on the actuator eliminates drift at power-off conditions. A critical design feature that enhances the overall motion performance is the joints with which the actuators are attached to the base and the moving top plate. The preloaded and backlash-free, cardan joints enhance not only the repeatability and positioning performance of the HXP200S, but are also key to its position stability and stiffness. Determine if the HXP200S-MECA is the right hexapod for your application by using Newport's free HexaViz Simulation Software.
The HXP200S-ELEC-D controller to be purchased separately to drive the HXP200S-MECA.
Resources & Downloads
3D Product Models
2D Product Drawings
Space Optics and Metrology with Hexapods(431 kB, PDF) Motion in 3-D: Newport Hexapod Coordinate Systems(476.8 kB, PDF) HXP200S-MECA(626.7 kB, PDF) Maintaining HXP Position after Controller Reboot(44.4 kB, ZIP) Maintaining HXP Position after Controller Reboot(67.3 kB, PDF) HexaViz Hexapod Brochure(2.5 MB, PDF) XPS-D Features Manual.pdf(8.7 MB, PDF) XPS-D Configuration Manual.pdf(5.6 MB, PDF) XPS-D User Interface Manual.pdf(8.3 MB, PDF) GroupPositionCurrentGet command and HXP controller.pdf(915.7 kB, PDF) HXP200-MECA & HXP200S-MECA User Manual(5.8 MB, PDF) HXP Series Hexapod Brochure(2.3 MB, PDF) XPS-D and HXP-ELEC-D Start-Up Manual.pdf(8.2 MB, PDF) Hexapod Solutions for Mass Transfer & Die Repair in Micro LED Manufacturing Equipment(2.1 MB, PDF) XPS Unified - Programmer's Manual.pdf(6.8 MB, PDF) Precision Alignment in Photonic Device Assembly and Testing(2.6 MB, PDF)


